Kemasan rincian:Film PE dibungkus pad dalam karton ekspor dengan pengering, 500 lembar per karton
Waktu pengiriman:5-7 hari kerja untuk stok, 12-18 hari untuk pemotongan mati khusus
Syarat-syarat pembayaran:T/T, L/C, PayPal, Western Union
Menyediakan kemampuan:800000 Potongan per Bulan
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GTP200 8.0 W/mK Thermal Conductive Silicone Pad for IGBT Power Module Cooling
Deskripsi Produk
GTP200 8.0 W/mK Thermal Conductive Silicone Pad GTP200 is a fiberglass reinforced thermal conductive silicone pad engineered for continuous heat transfer between high power semiconductors and heat sinks. With a bulk thermal conductivity of 8.0 W/m·K and a very low contact resistance, the pad moves heat away from IGBT modules, rectifier bridges and motor drivers before junction temperature builds up. Why GTP200 Delivers Excellent Thermal Conductivity 8.0 W/m·K through-plane